On Thursday, chip maker Qualcomm announced the launch of the Qualcomm RF360 Front End Solution, a new silicon aimed at enabling advanced connectivity inside smartphones.The new chipset packs global 4G LTE capabilities, and is said to be the first in the world to feature them. Furthermore, it also offers support for all seven cellular modes, including LTE-FDD, LTE-TDD, WCDMA, EV-DO, CDMA 1x, TD-SCDMA and GSM/EDGE.
RF360 “includes the industry’s first envelope power tracker for 3G/4G LTE mobile devices, a dynamic antenna matching tuner, an integrated power amplifier-antenna switch, and an innovative 3D-RF packaging solution incorporating key front end components,” Qualcomm also announced.
The new chip should offer seamless integration and lower power consumption, while also reducing the RF front end footprint inside of a smartphone almost in half, the company says.
The first devices to include the new Qualcomm RF360 Solution are expected to become available in the second half of the year.