14 DAY TRIAL // As Chinese mobile phone maker Huawei is gearing up for the release of new smartphones, the chassis of one of them appears to have emerged online in a leaked photo.
Available via weibo, said photo does not unveil too much on the device itself, but it does show that it will pack a metallic body.
Moreover, the leaked image unveils that the phone will sport a fingerprint sensor on the back, similar to the one HTC included in its large HTC One max last year, as Android Central notes.
According to leaked info on the device, Huawei plans on packing it with a new octa-core Kirin 920 processor, which should ensure performance capabilities on par with those offered by Qualcomm's Snapdragon 801 and Samsung's Exynos 5420.
While no official confirmation on this has been provided as of now, the fact that this phone might sport such a solid build and increased performance capabilities suggests that it might be launched as a high-end smartphone.
Apparently, Huawei’s Richard Yu has already confirmed on weibo that the company was working on a new, stunning smartphone that will build on the success it has seen over the past few years, and chances are that he has been referring to the handset that will pack this chassis on the back.
Hopefully, specific details on the yet unannounced device will be provided sooner rather than later, so keep an eye on this space for more on the matter.